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MCS1000 and GVC2000: Small Form Factor Mission Ready System

MCS1000 and GVC2000

by Abaco Systems

Abaco Systems announces MCS1000 and GVC2000, the first two mission ready systems to be based on the company’s innovative Lightning platform. The rugged, small form factor MCS1000 mission ready computer is ideal for I/O-rich applications where there are multiple target platforms or unique interfaces required on the computing solution. The system features the Intel® Xeon® E3 processor combined with a CoreAVI (or AMD) E8860 GPU, up to 16GBytes of DDR4 SDRAM and an XMC site. The rugged, small form factor GVC2000 high performance mission ready display computer is ideal for applications where top end data- or display processing is required, with complex or unique I/O needs. It features the 12-core Intel Xeon D processor with 32 Gbytes of RAM, combining it with an NVIDIA Maxwell GPU capable of up to 1.2 TeraFLOPS. It is an optimized solution for degraded visual environments, complex scene rendering, or driving multiple independent displays all requiring extensive GPU processing capabilities. Like the MCS1000, the GVC2000 can support up to 1 TB of removable SSD storage. Both the MCS1000 and GVC2000 leverage Abaco’s unique, patented MMS technology and feature four ECM (Electrical Conversion Module) slots, each of which can accommodate any of the 20+MMS I/O ‘tiles’ that are available off-the-shelf. MCS1000 and GVC2000 are designed to meet a rigorous qualification process based on selected MIL-STD-461G, DO- 160G, MIL-STD-704F and MIL-STD- 810G standards – further reducing the time and cost of deploying mission ready systems.

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MCS1000 and GVC2000: Small Form Factor Mission Ready System2017-11-21T12:41:57+01:00

Express-BD7: COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D

Express-BD7

by ADLINK Technology

ADLINK Technology announces Express-BD7, a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) ( formerly “Broadwell-DE”). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption 32PCIe lanes and multiple 10G Ethernet connectivity in a long product life solution. The Express-BD7 has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC (or non-ECC) memory. Input/output features include 24 PCIe Gen3 lanes, up to 8 PCIe Gen2 lanes, a single onboard Gigabit Ethernet port, USB 3.0/2.0 ports, and SATA 6 Gb/s ports, including an integrated Intel® 10G Ethernet controller supports two 10GBASE-KR interfaces, relevant sideband signals and NC-SI (Network Controller Sideband Interface). Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer. The Express-BD7 is designed to serve customers with optimized computing capability per watt and high speed connectivity requirements who want to outsource the custom core logic of their systems for reduced development time.

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Datasheet

Express-BD7: COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D2017-11-22T10:28:26+01:00

TMPE627: mPCIe Module with User-Programmable FPGA, AD/DA and Digital I/O

TMPE627

by TEWS TECHNOLOGIES

TEWS TECHNOLOGIES announces TMPE627 a standard full PCI Express Mini Card with a user programmable Artix-7 FPGA, AD/DA, and digital I/O channels. The TMPE627 provides 14 ESD-protected 5 V-tolerant TTL lines, individually programmable as input or output, 16-bit ADC offers 4 input channels that can be software configured to operate in single-ended or differential mode with a sampling rate of up to 200 ksps, while the DAC offers 4 channels of 16-bit analog outputs with software selectable output voltage that can be individually set per channel. Each TMPE627 is factory calibrated. The calibration information is stored in an on-board serial EEPROM unique to each TMPE627 module. The I/O signals are accessible through a 30 pin Pico-Clasp latching connector. The User FPGA is configured by a SPI flash. An in-circuit debugging option is available via a JTAG header for read back and real-time debugging of the FPGA design (using the Vivado ILA). User applications for the TMPE627 with 7A50T FPGA can be developed using the design software Vivado Design Suite HL WebPACK Edition available for free from www.xilinx.com. The TMPE627 is designed for industrial, COTS, and transportation applications, where specialized I/O or long-term availability is required. It provides a number of advantages including a customizable interface for unique customer applications and a FPGA-based design for long-term product lifecycle management.

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Datasheet

TMPE627: mPCIe Module with User-Programmable FPGA, AD/DA and Digital I/O2017-11-21T15:49:08+01:00

RGS-PR9000-A: Industrial advanced Layer 3 modular rack managed 10Gigabit Ethernet switch

RGS-PR9000-A

by ORing Industrial Networking

ORing Industrial Networking announces RGS-PR9000-A industrial ethernet switch as it features Layer 3 functions, Gigabit speed, optical fiber support, and compliance with IEC 61850-3 and IEEE 1613 standards for power substation and railway markets. Considering the need for high bandwidth capacity, the device is equipped with 4 slots which support up to 24 ports 1Gb Ethernet and 8 ports 10Gb Ethernet even in copper or fiber interfaces. Users can insert 1G or 10G modules based on their requirements and the working environments to deliver unprecedented bandwidth at an affordable cost. Layer 3 plays a key role in achieving higher security and management efficiency as the technology forwards packages and traffic to the destination intelligently based on IP addresses. As Oring’s first switch to support OSPF and PIM routing protocols, RGS-PR9000-A is a perfect fit for complex system architectures consisting of different domains or different VLANs. RGS-PR9000-A supports a variety of redundancy technologies to enable fast fault recovery. Besides standard MSTP, STP, and RSTP protocols, the switches also support Oring’s proprietary O-Ring self-healing technology. Furthermore, the wide operating temperature range from -40o°C to 85°C (for 10G SFP module, the operating temperature range is -20°C ~ 60°C) to enable the switches to work reliably in substation environments where temperature changes are extreme.

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Datasheet

RGS-PR9000-A: Industrial advanced Layer 3 modular rack managed 10Gigabit Ethernet switch2017-11-21T12:41:23+01:00

VBOX-3620-M12X: Skylake In-Vehicle Fanless Computer veicolari EN50155 compliant

VBOX-3620-M12X

by SINTRONES

SINTRONES announces VBOX-3620-M12X new In-vehicle Embedded Fanless PC based on Skylake platform for on-board application that comes with Skylake-U family SoC processor as i7-6600U, i5-6300U, i3-6100U and Celeron 3955U. VBOX-3620-M12X is design for Rolling Stock application in transport market by EN50155 Tx compiance and 3x GbE ports with M12 connector availability. Several I/O are provided as well as integrated wireless functionality as Bluetooth, Wi-Fi, GSM/GPRS, LTE w/twice SIM (Auto-switch), GPS w/Dead Reckoning. VBOX-3620-M12X is engineered using dual hot swappable SATA storage and optional internal battery kit for 10 minutes operating (Patent No. : M447854), over RAID 0, 1 support, optional 1 x CAN Bus 2.0B and triple independent display (2x DP and VGA). VBOX-3620-M12X support 9V-36V DC Power Input and can be operated in extreme weather conditions (Operating temperature: -40°C to +70°C)

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Datasheet

VBOX-3620-M12X: Skylake In-Vehicle Fanless Computer veicolari EN50155 compliant2017-10-25T12:06:28+02:00
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