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ADLINK Technology: Reducing Development Time and Effort with Computer on Module

ADLINK Technology Computer on Module

by ADLINK Technology

ADLINK Technology , part of the PICMG subcommittee has been a trusted supplier for more than 10 years for ETX®, COM Express®, SMARC® and Qseven®. For all the mentioned standard ADLINK offers a Starter kit that includes reference carrier board with complete I/O, all necessary cables, software and manuals for following standards:

  • COM Express® Basic size Type 6, the most popular computer-on-module form factor on the market.
  • COM Express® Compact Type 6, ideally suited to single chip x86 solutions (SoCs)
  • COM Express® Type 7, the most fundamental innovations of the COM Express®.
  • COM Express® Type 10 Mini, for low power platforms (TDP 12W and below).
  • SMARC®, supporting both ARM and x86 designs.
  • ETX®, earliest successful computer-on-module form factors.
  • Qseven®, integrates all the core components of a common x86 PC.

A fully range of COM Express module with Processor and Ram for every standard type is available on catalogue to satisfy a wide range of industrial application requirement, even in extended temperature range from -40°C to +85°C.

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ADLINK Technology: Reducing Development Time and Effort with Computer on Module2018-05-15T14:50:02+02:00

MVP Series: Value Family of Industrial Embedded PCs

MVP-series

by ADLINK Technology

ADLINK Technology presents MVP-series fanless industrial PCs family a perfect balance between features and performance in a compact size, all at an exceptionally cost effective price point. Incorporating the 6th Generation Intel® Core™ desktop i7-6700/i7-6700TE/i5-6500TE/i3-6100TE processor on H110/Q170 , the MVP Series offers 30% boost in performance in comparison with previous generation CPU, supports up to 32GB DDR4 memory for more powerful computing and the Intel® HD Graphics 530 enhances graphic performance. MVP-5000 is Integrated Fanless Embedded solution complemented by MVP-6000 models for application demanding expansions slot for acquisition board integration. MVP-6000 features 1 PCI + 1 PCI-e x16 Gen 3 and MVP-6010/6020 features 1 PCI-e x16 Gen 3 + 3 PCI or 2 PCI-e x16 Gen 3 + 2 PCI. Both series provides front-mounted I/O access including two independent displays with 1 VGA, 1 DVI and 2 DisplayPort I/O, 3 Intel® GbE ports with teaming function, 2 software-programmable RS-232/422/485 + 2 RS-232 ports, 6 external USB ports (4 USB 3.0 + 2 USB 2.0) supporting 1.6A, 8-CH DI and 8-CH DO, 1 Mic-in and 1 Line out. The storage options include 1 SATA port for 2.5″ HDD/SSD installation, 1 Type II Cfast. MVP Series supports 0°C to 50°C fanless operations making them ideally solution to a wide variety of machine, factory, logistic automation, and general embedded applications.

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MVP Series: Value Family of Industrial Embedded PCs2018-04-24T10:59:04+02:00

Starter Kit for COM Express and SMARC modules

Starter Kit

by ADLINK Technology

ADLINK Technology was chair of the PICMG subcommittee that was tasked with defining the COM Express COM.0 Revision 3.0 specification update, is a pioneer in the development of SMARC modules and a long track record of being a trusted supplier for more than 10 years for the following products: PC/104, ETX, COM Express, SMARC and Qseven. For all the mentioned standard Adlink offers a Starter Kit that includes reference carrier board with complete I/O, all necessary cables, software and manuals for following standards:

  • COM Express Basic size Type 6, most popular and widely used computer-on-module form factor on the market;
  • COM Express Compact Type 6, form factor ideally suited to single chip x86 solutions (SoCs) with a power range between 5 to 20 watts;
  • COM Express Type 7, the most fundamental innovations of the COM Express;
  • COM Express Type 10 Mini, for low power platforms (TDP 12W and below);
  • SMARC, supporting both ARM and x86 designs;
  • ETX, earliest successful computer-on-module form factors;
  • Qseven, integrates all the core components of a common x86 PC.

A fully range of COM Express module with Processor and Ram for every standard type is available on catalogue to satisfy a wide range of industrial application requirement, even in extended temperature range from -40 to +85 °C.

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Datasheet

Starter Kit for COM Express and SMARC modules2022-01-27T09:37:10+01:00

MXE-210: Rugged Compact IoT Gateway/Controller

MXE-210

by ADLINK Technology

ADLINK Technology announces MXE-210, a small footprint IoT Gateway/Controller fully operable in harsh environments from -40°C to 85°C, making it an ideal choice for industrial automation, transportation, agriculture/aquaculture, and smart city applications. Functioning as both a gateway and embedded controller, the MXE-210 bridges the gap between Operations Technology (OT) and Information Technology (IT) data interchanges, with support for third party manufacturers via its wide range of industry standard compliances; support is included for Modbus, EtherCAT, DDS, MQTT, and CANOpen by Vortex Edge Connect, as well as Wi-Fi, BT, LoRa, 3G, and 4G LTE for data communication and wireless connectivity. As a controller, the MXE-210 leverages the same protocols to directly communicate with and manage any standard industrial device. The MXE-210 Series further supports a wide range of comprehensive security measures, providing protection from the inside out with the benefits of TPM 2.0, Intel® Boot Guard, and UEFI Secured Boot. In addition, the MXE-210 comes equipped with an Intel Atom™ x7-E3950/x5-E3930 processor (formally codenamed Apollo Lake-I), one DisplayPort, two USB 2.0, two USB 3.0, two GbE ports, two COM ports(RS232/422/485), two mPCIe slots, one USIM slot, one mSATA, one SATA-III, one Micro SD slot, and support for DIN-rails and wall mounting. Optional extras include audio mic-in, line-out support, eight isolated DI with interrupt and eight isolated DO, and two additional COM ports (RS232/422/485).

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MXE-210: Rugged Compact IoT Gateway/Controller2022-01-27T09:37:09+01:00

Express-BD7: COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D

Express-BD7

by ADLINK Technology

ADLINK Technology announces Express-BD7, a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) ( formerly “Broadwell-DE”). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption 32PCIe lanes and multiple 10G Ethernet connectivity in a long product life solution. The Express-BD7 has dual stacked SODIMM sockets supporting up to 32 GB of DDR4 ECC (or non-ECC) memory. Input/output features include 24 PCIe Gen3 lanes, up to 8 PCIe Gen2 lanes, a single onboard Gigabit Ethernet port, USB 3.0/2.0 ports, and SATA 6 Gb/s ports, including an integrated Intel® 10G Ethernet controller supports two 10GBASE-KR interfaces, relevant sideband signals and NC-SI (Network Controller Sideband Interface). Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor, and watchdog timer. The Express-BD7 is designed to serve customers with optimized computing capability per watt and high speed connectivity requirements who want to outsource the custom core logic of their systems for reduced development time.

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Express-BD7: COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D2017-11-22T10:28:26+01:00
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