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IGAP-610H+ / IGAP-W612H+: Gigabit Wireless Aps for Outdoor and Indoors Industrial Applications

IGAP-610H+ / IGAP-W612H+: Gigabit Wireless Aps for Outdoor and Indoors Industrial Applications


Oring has launched two Gigabit wireless Aps IGAP-610H+ and IGAP-W612H+ to help build fast and robust wireless communications network inside and outside their industrial settings. The newly launched industrial wireless Aps both come with a Gigabit Ethernet port, IEEE 802.11 a/b/g/n capabilities and PoE support. The IGAP-610H+ is equipped with an IP30-rated casing for indoor use and DIN-Rail/Wall-mount while the IGAP-W612H+ features an IP67-rated waterproof housing and EN50155 compliance, making it a perfect solution for outdoor settings and railway applications. With IEEE 802.11 a/b/g/n, the Aps can deliver a data rate of 300Mbps. Both of these two models offer multiple operating modes such as AP, Client, and Repeater which also support IEEE 802.3af PoE with 15.4W power output per port. The PoE function enables the Aps to be deployed in remote areas or places where cabling is difficult. The IGAP-612H+ and IGAP-W612H+ allow operation at 2.4GHz or 5GHz, support remote configuration by WEB interface via LAN port or WLAN interface and can withstand harsh environmental conditions with a wide temperature range from -25°C to 70°C, moreover IGAP-W612H+ with IP67-rated housing and 6KV antenna surge protection ensures reliable data transmission on moving vehicles or outdoor.

IGAP-610H+ / IGAP-W612H+: Gigabit Wireless Aps for Outdoor and Indoors Industrial Applications2024-05-29T15:24:07+02:00

ABOX-5200: Intel Coffee Lake 8th Gen Core i7 In-Vehicle Fanless Computer

ABOX-5200: Intel Coffee Lake 8th Gen Core i7 In-Vehicle Fanless Computer


SINTRONES introduces ABOX-5200 the new Industrial fanless In-Vehicle computer powered by Intel 8th-Gen Hexa Core i7 CPU that can provide high computing performance on graphic processing by harnessing the power of its graphics processing unit (GPU). The ABOX-5200 was engineered using dual hot swappable 2 x 2.5″ Drive Bay for SATA Type HDD/SSD, RAID 0,1,5, 1 x mSATA storage with 2 x DDR4 2400 MHz SO-DIMM up to 32GB memory. A well designed I/O system provides 3 x RS-232/422/485 (Auto Direction Control) serial port, 8 x GPI and 4 x GPO DIO port, and 3 x Full Mini-PCIe Slots and 1 x M.2 A-E Key 2230 Slot (2 x SIM Card Sockets for 3G/LTE) expansion bus. By Ethernet side ABOX-5200 provides 10 x RJ45 Ports for GbE with 8 x POE 100W max power budget as optional. Continuously, ABOX-5200 has the optional internal battery kit for 10 minutes operating (SINTRONES patented technology), 9-48VDC Input and wide range operating temperature 40°C ~ 70°C that can be operated in extreme weather conditions as ideal solution for Smart Factory Automation, Surveillance system and Visual management applications.

ABOX-5200: Intel Coffee Lake 8th Gen Core i7 In-Vehicle Fanless Computer2019-02-11T09:09:12+01:00

PPC-F17C-Q370: 17” Modular Panel PC w/8° Gen Intel Core i3/i5/i7 processor

PPC-F17C-Q370: 17” Modular Panel PC w/8° Gen Intel Core i3/i5/i7 processor


IEI Technology announces PPC-F17C-Q370, the latest industrial Panel PC featuring a 17″ 5:4 1280 (W) x 1024 (H) display and 8th Generation Intel® Core™ i7/i5/i3 and Pentium® processor (formerly Coffee Lake) AI hardware ready system ideal for deep learning inference computing. PPC-F17C-Q370 is available with PCAP touch with 10-point multitouch and anti-glare coating with IP66 IP Grade for dust and water protection. The new Panel PC supports up to 64GB DDR4 memory and two PCIe 3.0 x8 and two PCIe 3.0 x4 slots and various I/O Interfaces as 2 x RS-232, 6 x USB 3.0, 2 x GbE, 1 x Audio port (line-out) and 1 x HDMI output. By storage side PPC-F17C-Q370 features 4-Bay Hot Swappable HDD with RAID 0/1/5/10 Protection and Dual M.2 M-Key NVMe PCIe 3.0 x4 SSD support for high speed transfer rate. PPC-F17C-Q370 has Built-in 250W/350W 80-Plus Gold Power Supply, -20°C/+50°C operating temperature and can be integrated with several expansion board for wide range of application as retail, machine vision, control process and industrial automation.

PPC-F17C-Q370: 17” Modular Panel PC w/8° Gen Intel Core i3/i5/i7 processor2019-01-23T14:36:28+01:00

F26L: 3U CompactPCI PlusIO with Apollo Lake Intel Atom Processor Blade

cPCI-3630: SBC 3U CompactPCI con Intel Atom Apollo Lake

F26L: 3U CompactPCI PlusIO with Apollo Lake Intel Atom Processor Blade

 


MEN MIKRO introduces F26L low-power CPU board equipped with Intel Atom Apollo Lake-I dual-core or quad-core System-on-a-Chip (SoC). Due to the low power architecture on the Intel Atom processor, the CPU card has a total power consumption of max. 6.5 Watts to 12 Watts, while having a clock frequency of up to 1.6 GHz. The F26L supports the CompactPCI PlusIO (PICMG 2.30) specification, meaning it can be used in a hybrid system for control of both CompactPCI and CompactPCI Serial peripheral boards. The F26L board has been equipped with a specially outlined heat sink for applications with extreme temperatures, for extended operation from -40°C to +85°C, in compliance with EN 50155, class TX. The standard I/O available at the front panel of the F26L includes VGA, two Gigabit Ethernet and two USB 3.0 ports. The F26L can be extended by different side cards. Additional functions include a variety of different UARTs or another four USBs, SATA for hard disk connection and HD audio. The F26L operates in Windows 10 and Linux environments as well as under real-time operating systems that support Intel’s multi-core architecture ideal solution for kind of application common in the rail market, in industrial automation and in the power and energy sector.

F26L: 3U CompactPCI PlusIO with Apollo Lake Intel Atom Processor Blade2024-05-29T15:22:46+02:00

VP869: 6U VPX FPGA Board w/2x Xilinx Virtex Ultrascale+ FPGA

VP869

VP869: 6U VPX FPGA Board w/2x Xilinx Virtex Ultrascale+ FPGA

 


Abaco Systems announced the VP869 high performance 6U OpenVPX FPGA processing board. Featuring two Xilinx® UltraScale+™ FPGAs and a Zynq® 7000 Series multiprocessor system-on-chip (MPSoC), delivering up to 3.8x more DSP resources and 2.4x more integrated memory than its orm, fit and function predecessor VP868. Two industry standard (VITA 57) FMC+ sites are provided on the VP869 for high performance analog I/O, digital communications or video input. The VP869’s flexibility derives in part from the opportunity it provides to choose either of two Virtex Ultrascale+ FPGAs, allowing the optimum application-specific trade-off between performance, power consumption and price. A key feature of the VP869 is its extreme backplane bandwidth delivering 594 Gbps of data throughput for advanced processing and offload applications and it provides up to 300 Gbps of data bandwidth to and from the FMC+ I/O modules, enabling the utilization of the latest ADC and DAC technology for next generation wideband applications. In some applications, the VP869’s onboard Zynq 7000 device with its embedded ARM® cores can provide the control functionality that would normally be delivered by a single board computer, creating the opportunity to minimize slot usage and thus size, weight and power. Reduced time to deployment is significantly enhanced by Abaco’s set of aids as open board support package that provide a highly functional reference design example to simplify integration of application-specific IP. The VP869 is designed for the most demanding mission critical applications where extreme FPGA processing and I/O bandwidth capabilities are needed. Typical applications include electronic warfare, radar/sonar processing, software defined radio, advanced digital beamforming, multi-channel digital receivers/transmitters and satellite communications systems.

VP869: 6U VPX FPGA Board w/2x Xilinx Virtex Ultrascale+ FPGA2019-01-23T14:35:59+01:00
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