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Express-ADP: COM Express Type 6 with Intel Core 12th Gen Alder Lake-P

June 2023

Express-ADP: COM Express Type 6 with Intel Core 12th Gen Alder Lake-P

Adlink Technology Inc. introduces Express-ADP, the new COM-Express Type 6 module equipped with 12th generation processors and based on the Alder Lake-P platform. The hybrid architecture with P-core (performance) and E-core (efficiency) ensures high performance together with low power consumption. The high scalability of integrable CPUs, from Celeron up to i7, makes Express-ADP an extremely versatile solution that can be easily integrated to realise customised embedded boards. The Express-ADP module’s managed RAM memory is expandable up to a maximum of 64GB DDR5 on dual SODIMM sockets, while the video compartment is managed so as to guarantee the simultaneous and independent connection of up to four of the available ports: DisplayPort, HDMI, LVDS, eDP, VGA. Express-ADP also features 4x USB 3.2 ports, 4x USB 2.0, 2x SATA 6Gb/s, 2x UART, 8x GPIO, and support for NVMe-type SSDs. Express-ADP is available in a standard version with an operating temperature of 0°C / +60°C or in an Extreme Rugged version with an extended operating temperature of -40°C / +85°C.

Express-ADP: COM Express Type 6 with Intel Core 12th Gen Alder Lake-P2023-06-22T15:07:40+02:00

OP-F19: 19″ Open Frame Monitor with Full HD resolution

June 2023

OP-F19: 19″ Open Frame Monitor with Full HD resolution

Austin Hughes introduces the OP-F19, the new 19″ FULL HD 1920 x 1080 resolution open frame display designed for 24-hour operation.
OP-F19 enables the display of 16.7 million colours ensuring high image quality and is available with a standard 350 cd/m² brightness display or a high brightness 1000 cd/m² version. OP-F19 offers VGA and DVI inputs by default while options include Display port and HDMI, capacitive or resistive touchscreen, anti-glare and anti-vandal glass, and 12/24/48/125VDC power input. In addition, the OP-F19 optionally offers Video Management & Transmission over Network, which allows multiple monitors to be managed and transmitted remotely. OP-F19 has an operating temperature range of 0°C to 55°C and a high level of shock and vibration resistance.

OP-F19: 19″ Open Frame Monitor with Full HD resolution2023-06-22T15:07:48+02:00

AIE-KX: Embedded PC with NVIDIA Jetson AGX Orin

May 2023

AIE-KX: Embedded PC with NVIDIA Jetson AGX Orin

Aetina Corporation introduces AIE-KX, the new Edge Computing platform for industrial applications related to artificial intelligence, based on NVIDIA Jetson AGX Orin and suitable for all sizes of AI applications due to its high computing power in combination with excellent energy efficiency, which keeps power consumption low. AIE-KX integrates 32GB/64GB Jetson AGX Orin, which is up to 8 times more powerful than the previous generation, and offers up to 275 TOPS, 2048 NVIDIA CUDA cores and 64 Tensor cores, enabling server-class AI inference at the edge with low latency. The AIE-KX offers a wide range of I/O including one GbE port, one 10Gbe port, up to four POE Gbe ports, two USB 3.2 Gen1, one USB 2.0, two USB Type C, two COM ports, one HDMI and two CANBus ports. In addition, the AIE-KX can be equipped with WIFI/BT and LTE/5G via M.2 expansion slots. For data storage, the built-in 64GB eMMC 5.1 can be expanded via M.2 NVMe module. AIE-KX measures 220x170x79 mm and supports wall and DIN-RAIL mounting, operating temperature from -20°C to +70°C and 9-36VDC power supply for industrial applications.

AIE-KX: Embedded PC with NVIDIA Jetson AGX Orin2023-05-24T09:37:15+02:00

VBOX-3630R-M12X: On board Computer with 11th generation CPU and 4x GbE LAN M12X

May 2023

VBOX-3630R-M12X: On board Computer with 11th generation CPU and 4x GbE LAN M12X

Sintrones Technology introduces the VBOX-3630R-M12X, the fanless in-vehicle computer equipped with eleventh generation Intel Core i7-1185G7E, i5-1145G7E, i3-115G4E and Celeron 6305E processors with Tiger Lake architecture ideal for applications requiring high computing power and low power consumption. VBOX-3630R-M12X supports -40ºC /+70ºC operating temperature and offers a wide range of I/O including three COM ports, two USB 3.2 Gen2 ports, two USB 2.0 ports, four Ethernet ports including three GbE and one 2.5GbE, all in M12X format (PoE also available), four independent displays via two HDMI ports, one DisplayPort and one DVI-D port, DIO, two SIM sockets, two removable 2.5″ HDD/SSD bays and one M.2 slot for NVMe SSD. In addition, VBOX-3630R-M12X is powered 24-110VDC for Rolling Stock with power ignition for proper vehicle operation and can be optionally equipped with an internal smart battery. The hardware components are protected by a robust aluminium alloy single-block chassis designed for wall mounting.

VBOX-3630R-M12X: On board Computer with 11th generation CPU and 4x GbE LAN M12X2023-05-24T09:37:24+02:00

GAP-151RO-S7: Rugged 1U Server with single Intel Xeon Scalable 3rd Generation

 

May 2023

GAP-151RO-S7: Rugged 1U Server with single Intel Xeon Scalable 3rd Generation

Goma Elettronica SpA introduces GAP-151RO-S7, the new high-performance, MIL-rated 1U rugged servers designed for applications in critical operating environments. GAP-151RO-S7 rugged servers integrate a single 3rd generation Intel Xeon Scalable processor (Ice Lake SP) offering up to 40 cores and 80 threads, 4TB RAM and up to 64 PCIe lines. Supported IPMI services allow local and remote control of the equipment and its integrated devices, enabling intervention in the event of alarms and critical issues. GAP-151RO-S7 rugged servers are designed for 19″ rack mounting, are 510mm deep and offer rear I/O and power supply. GAP-151RO-S7 rugged servers offer the possibility to install up to nine removable 2.5″ SSDs and one internal M.2 NVMe SSD. In addition, up to three PCIe cards can be installed, two full-length and one low profile. GAP rugged servers are qualified to MIL-STD-810H for temperature and humidity, MIL-STD-810G for shock, MIL-STD-167-1A for vibration, and can be optionally qualified for compliance to MIL-STD-461.

GAP-151RO-S7: Rugged 1U Server with single Intel Xeon Scalable 3rd Generation2023-05-24T09:37:34+02:00
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