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VPX3-MXM-RTX5000: Rugged SOSA-aligned 3U VPX NVIDIA GPGPU Blade

July 2023

VPX3/MXM-RTX5000: Rugged SOSA-aligned 3U VPX NVIDIA GPGPU Blade

Adlink Technology Inc. introduces VPX3-MXM/RTX5000, the new 3U VPX general-purpose GPU (GPGPU) blade based on NVIDIA RTX5000, featuring TURING architecture with 3072 CUDA cores. VPX3-MXM/RTX5000 supports 16 GB of GDDR6 graphics memory with 4x DisplayPort or 4x HDMI outputs and features PCIe x16 Gen3 slots configurable to P1, set to PCIe x8 Gen3 by default. VPX3-MXM/RTX5000 supports Windows 10, Linux and real-time operating systems (RTOS) on request. VPX3-MXM/RTX5000 is also SOSA-aligned (Sensor Open System Architechture), one of several standards under the Modular Open Systems Approach (MOSA) initiative. SOSA focuses on key interfaces and open standards, based on VPX specification (VITA 46/48/65), and aims to develop a common and modular hardware architecture for next-generation mission-critical applications. VPX3-MXM/RTX5000 is available in conduction cooled version, and is suitable for multiple applications including AI and machine learning in harsh environments and SWaP optimization, and offers -40°C /+ 85°C operation.

Datasheet

VPX3-MXM-RTX5000: Rugged SOSA-aligned 3U VPX NVIDIA GPGPU Blade2023-07-24T16:48:33+02:00

KSTL105: Industrial IP67/IP65 keyboard with trackball

July 2023

KSTL105: Industrial IP67/IP65 keyboard with trackball

NSI introduces KSTL105, a new industrial keyboard featuring 105 short-stroke keys and an integrated 50mm waterproof laser trackball. Designed to operate in both indoor and outdoor environments where high typing speed is required while maintaining outstanding sealing characteristics, KSTL105 keyboard is realised on an aluminium plate with polyester top and features IP67 protection in the panel mount version, IP65 in the desktop version. KSTL105 keyboard is available in several language layouts and can be configured with PS/2 or USB output.

Datasheet

KSTL105: Industrial IP67/IP65 keyboard with trackball2023-07-24T16:48:41+02:00

AIE-PX: Embedded fanless PC with NVIDIA Jetson AGX Orin

 

June 2023

AIE-PX: Embedded fanless PC with NVIDIA Jetson AGX Orin

Aetina Corporation introduces AIE-PX, the new fanless Edge Computing platform for industrial applications related to artificial intelligence, based on NVIDIA Jetson AGX Orin and suitable for all sizes of AI applications due to its high computing power in combination with excellent energy efficiency, which keeps power consumption low. AIE-PX integrates 32GB/64GB Jetson AGX Orin, which is up to 8 times more powerful than the previous generation, and offers up to 275 TOPS, 2048 NVIDIA CUDA cores and 64 Tensor cores, enabling server-class AI inference at the edge with low latency. The AIE-PX offers a wide range of I/O including one GbE port, one 10Gbe port, up to four POE Gbe ports, two USB 3.2 Gen1, one USB 2.0, two USB Type C, two COM ports, one HDMI and two CANBus ports. In addition, the AIE-PX can be equipped with WIFI/BT and LTE/5G via M.2 expansion slots. For data storage, the built-in 64GB eMMC 5.1 can be expanded via M.2 NVMe module. AIE-PX measures 270x195x80 mm and supports wall and DIN-RAIL mounting, operating temperature of -25°C /+55°C and 9-36VDC power supply for industrial applications.

Datasheet

AIE-PX: Embedded fanless PC with NVIDIA Jetson AGX Orin2023-06-22T15:07:11+02:00

SYS-210SE-31D: 2U Three Node Server with 3rd Gen Intel Xeon CPU

 

June 2023

SYS-210SE-31D: 2U Three Node Server with 3rd Gen Intel Xeon CPU

Supermicro Computers Inc. introduces the SYS-210SE-31D, the new three-node server with high density, performance and maintainability derived from the latest CPU architecture and hot-swappable tool-less design. It can now effortlessly handle resource-intensive tasks, such as AI/ML processing, Multi-Access Edge Computing, and high-performance computing. The SYS-210SE-31D offers a single 3rd generation Intel Xeon Scalable processor per node, each with up to 32 cores and support for integrated next-generation accelerators and GPUs. SYS-210SE-31D systems offer DDR4-3200 MHz memory, PCIe 5.0 for twice the I/O bandwidth of the previous generation, and two M.2 slots of NVMe type per node. Regarding networking, each node is equipped with an RJ45 port with shared IPMI. SYS-210SE-31D also offers redundant and shared power supply between the nodes, offering high energy optimisation while maintaining a very high standard of security.

Datasheet

SYS-210SE-31D: 2U Three Node Server with 3rd Gen Intel Xeon CPU2023-06-22T15:07:21+02:00

GAP-251F-S7: 2U Rugged Servers with dual 3rd Gen Intel Xeon Scalable Processors and Front I/O

 

June 2023

GAP-251F-S7: 2U Rugged Servers with dual 3rd Gen Intel Xeon Scalable Processors and Front I/O

Goma Elettronica SpA introduces GAP-251F-S7, the high performance, MIL-grade 2U rugged servers suitable for applications in critical operating environments. GAP-251F-S7 rugged servers integrate single or dual 3rd generation Intel Xeon Scalable Processors (Ice Lake SP) supporting up to 40 cores and 80 threads, 4TB RAM and up to 64 PCIe lanes. Supported IPMI services allow local and remote control of integrated devices and allow for immediate actions in case of critical issues. Rugged GAP-251F-S7 servers are designed for 19″ rack mounting, have a depth of 510mm and feature power supply and I/O on the front. As far as storage is concerned, these servers offer the possibility to install up to four NVMe U.2 SSDs or six SATA/SAS 2.5″ SSDs, all removable from the front, as well as an internal M.2 NVMe drive. In addition, up to six full height cards can be installed. GAP rugged servers are MIL-STD-810G qualified for temperature, shock and vibration and can have optional compliance to MIL-STD-461.

Datasheet

GAP-251F-S7: 2U Rugged Servers with dual 3rd Gen Intel Xeon Scalable Processors and Front I/O2023-06-22T15:07:31+02:00
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