June 2023

Express-ADP: COM Express Type 6 with Intel Core 12^th Gen Alder Lake-P

Adlink Technology Inc. introduces Express-ADP, the new COM-Express Type 6 module equipped with 12th generation processors and based on the Alder Lake-P platform. The hybrid architecture with P-core (performance) and E-core (efficiency) ensures high performance together with low power consumption. The high scalability of integrable CPUs, from Celeron up to i7, makes Express-ADP an extremely versatile solution that can be easily integrated to realise customised embedded boards. The Express-ADP module’s managed RAM memory is expandable up to a maximum of 64GB DDR5 on dual SODIMM sockets, while the video compartment is managed so as to guarantee the simultaneous and independent connection of up to four of the available ports: DisplayPort, HDMI, LVDS, eDP, VGA. Express-ADP also features 4x USB 3.2 ports, 4x USB 2.0, 2x SATA 6Gb/s, 2x UART, 8x GPIO, and support for NVMe-type SSDs. Express-ADP is available in a standard version with an operating temperature of 0°C / +60°C or in an Extreme Rugged version with an extended operating temperature of -40°C / +85°C.