Expandible Embedded Computers – Intel Core i7/i5/i3 – 8° / 9° Gen. – Coffee Lake / Coffee Lake Refresh –
MVP-6100-MXM | DLAP-4000 | DLAP-3000 | |
CPU | Intel Xeon E3 228xGE Intel Core i7-9700E Intel Core i7-9700TE Intel Core i7-9500TE Intel Core i3-9100E Intel Celeron G4900T |
Intel Core i7-9700E Intel Core i5-9500E Intel Core i3-9100E Intel Core i7-9700TE Intel Core i5-9500TE Intel Core i3-9100TE |
Intel Core i7-9700TE Intel Core i7-8700T Intel Core i5-8500T Intel Core i3-8100T Intel Celeron G4900T |
Chipset | 2-Expansion Slots: H310 4-Expansion Slots: C246 |
H310 | H310 |
Memory | 8/16/32GB DDR4 ECC 2400MHz | Up to 32GB DDR4 ECC 2666MHz | Up to 64GB DDR4 ECC 2666MHz |
GPU | NVIDIA MXM P1000 NVIDIA MXM P2000 NVIDIA MXM P3000 NVIDIA MXM P5000 |
NVIDIA QUADRO P2200 NVIDIA QUADRO P4000 NVIDIA QUADRO P5000 NVIDIA QUADRO RTX 4000 NVIDIA QUADRO RTX 5000 NVIDIA QUADRO RTX 6000 NVIDIA QUADRO RTX 8000 |
NVIDIA MXM P1000 NVIDIA MXM P2000 NVIDIA MXM P3000 NVIDIA MXM P5000 |
LAN Ports | 3x Intel GbE: 2x i211AT + i219 | 2x GbE Realtek RTL8111G | 4x Intel GbE: 3x i210AT + 1x i219 |
Display | 2x DP++ | 1x DP | 2x DP |
1x DVI-D | 1x DVI | – | |
1x VGA | 1x HDMI | – | |
4x DP 1.4 powered by MXM P1000/P2000 OR 3x DP 1.4 powered by MXM P3000/P5000 |
Additional display outputs from GPU | 4x DP from GPU | |
I/O | COM1/2: RS-232/422/485 COM3/4: RS-232 Optional: COM5/6 RS-232 (shared w/ DI/O) |
1x RS-232/422/485 4x RS-232 |
– |
3x USB3.1 Gen 1 3x USB2.0 Optional: up to 3x USB3.1 Gen 2 w/ C246 |
4x USB 3.1 Gen1 2x USB 2.0 |
4x USB 3.1 Gen1 4x USB 2.0 |
|
1x internal USB2.0 dongle | – | – | |
Line-out, Mic-in Optional: speaker-out |
Mic-in, Line-out, Line-in | Optional: Mic-in, Line-out, Line-in Optional: Mic-in, L/R speaker-out (6W + 6W) Optional: Line-in, L/R speaker-out (6W + 6W) |
|
DIO | 8-CH DI and 8-CH DO | – | Optional: 1x DI/DO with 4 in, 4 out, 1x ground pin, 1x power pin |
USIM Socket | 2 | – | – |
Exp. Slots | PCIe x16 + PCI w/ H310 PCIe x16 + 2 PCIe x4 + PCI w/ C246 |
1x PCIe X16 Dedicated to GPU 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module |
1x MXM Slot |
Storage | 2x 2.5’’ SATA internal (support RAID w/ C246) 1 x CFast type II Optional: additional 2x 2.5’’ SATA internal (w/ C246) |
2x 2.5″ SATA 6Gb/s internal drive bays 1x M.2 M key supporting 2280 SATA SSD modules |
2x 2.5″ SATA 6Gb/s external drive bays 1x SATA 6Gb/s signal via M.2 B key connector |
Power Input | 12 to 24Vdc | 100 to 240 VAC | DC 12V input (Molex DC-in jack) Optional: 240W (12V/20A) AC/DC adapter |
Dimensions | 2 slots: 165 (W) x 240 (D) x 210 (H) mm 4 slots: 206 (W) x 240 (D) x 210 (H) mm |
220 (W) x 300 (D) x 150 (H) mm | 235 (W) x 182 (D) x 75mm (H) mm |
Mounting | Wall-mount | – | Optional: Wall-Mount bracket |
Oper. Temp | Xeon CPU Standard: 0°C to 40°C Extended: -10°C to 40°C Other CPU Standard: 0°C to 50°C Extended: -10°C to 60°C |
Depending on GPU: 0 to 50°C 0 to 40°C |
0°C to 50°C |
Accessories | Optional: 220W or 280W AC/DC adapter |
– | Optional: 240W (12V/20A) AC/DC adapter |
Certifications | Vibration: 2 Grms, 5-500 Hz, 3 axes (w/2.5″ SSD) Vibration: 0.5 Grms, 5-500 Hz, 3 axes (w/ HDD) Shock: 50 G, half sine 11ms duration (w/ 2.5″ SSD) ESD: Contact 4KV, Air 8KV EMC: EN61000-6-4/-2, CE, FCC Class A |
EN55032/EN55035 UL/cUL, CB, CCC |
EN55032/EN55024 UL/cUL, CB, CCC |
Ordering Information | MVP-612X-MXM-1E/M4G/[GPU]MVP-612A-MXM-1E/M4G/[GPU]MVP-6121-MXM-1E/M4G/[GPU]MVP-6122-MXM-1E/M4G/[GPU]MVP-6123-MXM-1E/M4G/[GPU]MVP-614X-MXM-2E/M4G/[GPU]MVP-614A-MXM-2E/M4G/[GPU]MVP-6141-MXM-2E/M4G/[GPU]MVP-6142-MXM-2E/M4G/[GPU]MVP-6143-MXM-2E/M4G/[GPU] | DLAP-4001/M8G/[GPU]DLAP-4002/M8G/[GPU]DLAP-4003/M8G/[GPU]DLAP-4004/M8G/[GPU]DLAP-4005/M8G/[GPU]DLAP-4006/M8G/[GPU]DLAP-4007/M8G/[GPU]DLAP-4008/M8G/[GPU]DLAP-4009/M8G/[GPU]DLAP-400A/M8G/[GPU]DLAP-400B/M8G/[GPU]DLAP-400C/M8G/[GPU] | DLAP-3000-CFP1 DLAP-3000-CFP2 DLAP-3000-CFP12 DLAP-3000-CFP3 DLAP-3000-CFP5 DLAP-3000-CFP35 |