July 2022

COM-HPC-sIDH: COM-HPC Server Type Size D Module with Intel Xeon D-2700 Processor

Adlink Technology Inc. introduces COM-HPC-sIDH, its latest Intel Xeon D-based COM-HPC server type Computer-on-Modules (COMs). Powered by Intel Xeon D-2700 processor (Codename: Ice Lake-D) with up to 20 CPU cores, 30 MB cache, 512 GB DDR4 memory capacity, COM-HPC-sIDH features 8x 10G or 4x 25G Ethernet, up to 32 PCIe Gen4 lanes and has a power consumption of 65 to 118 W. Furthermore it offers a module management controller (MMC) featuring an IPMB interface and a dedicated PCIe-BMC lane with convenient remote management functions such as serial over LAN (SOL) and iKVM. Featuring Intel Deep Learning Boost (VNNI) and Intel AVX-512 for AI inference processing, the COM with Intel Ice Lake-D ais designed to fulfil on-device machine learning and deep learning processes. In addition, the COMsfeatures Intel Time Coordinated Computing (TCC) and provide Time-Sensitive Networking (TSN) support — bringing CPU core control and timely synchronisation over networked devices while enabling low-latency, deterministic performance for driving hard-real-time workloads. Built for edge and rugged AI applications, the COM-HPC empower system integrators to realise their IoT innovations, from edge networking, unmanned aerial vehicles, autonomous driving and robotic surgery to rugged HPC servers, 5G base stations.